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Description
TDV Microcut Saw & Refills
TDV Microcut is a hack saw frame designed for the removal excesses of composites, adhesives, cements and amalgams from the proximal area. It is also indicated for Inlay and Onlay, laminated vaneers and stripping in orthodontic procedures.
Features and Benefits:
Device developed to adapt special components:
Saw Blade removes surplus material without damaging the contact point and is only 0.05mm thick
Diamond Strip allows you to perform stripping in orthodontic procedures and is only 0.01mm thick
Easy and Safe handling
All components are autoclavable
Brand TDV
Category Restorative & Cosmetic
Subcategory Matrix Bands & Retainers
Subcategory Strips & Foils
Related Products
- RZ431, C02, Gd Vats Appartment, Street Number 9, Raj Nagar I, Delhi, 110077
- info@dental56.com
- +91 93104 79620
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8888 South Avenue Street, New York.
Mon - Sat 8:00 AM - 5:00 PM; Sun 9:00 AM - 6:00 PM
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